Characterizing the Soldering Alloy Type Zn–Al–Cu and Study of Ultrasonic Soldering of Al7075/Cu Combination
1
Faculty of Materials Science and Technology Trnava, Slovak University of Technology in Bratislava, Jána Bottu No. 2781/25, 917 24 Trnava, Slovakia
2
FMT—Faculty of Materials Science and Technology, Technical University of Ostrava, 17. Listopadu 15, 708 33 Ostrava, Poruba, Czech Republic
*
Author to whom correspondence should be addressed.
Metals 2021, 11(1), 27; https://doi.org/10.3390/met11010027
Received: 9 December 2020
/
Revised: 22 December 2020
/
Accepted: 22 December 2020
/
Published: 25 December 2020
The aim of the research was to characterize the soldering alloy type Zn–Al–Cu and study the fluxless ultrasonic soldering of the combination of aluminum alloy type Al7075 with copper substrate. The Zn–Al–Cu solder is of the close-to-eutectic type with two phase transformations: the eutectic transformation at 378 °C and the eutectoid transformation at 285 °C. The solder microstructure is formed of a matrix composed of the solid solutions of aluminum (Al) and zinc (Zn) in which the copper phases CuZn4 and CuAl2 are precipitated. The shear strength of the soldering alloy type Zn5Al with copper addition reaches values from 167 to 187 MPa and it depends on the copper content in the solder. The bond with aluminum alloy type Al7075 is formed due to the solubility of Al in zinc solder at the formation of solid solution Al. Contrary to this observation, the bond with the copper substrate is in this case formed due to the interaction of zinc and aluminum with the copper substrate. Two new intermetallic phases, namely Al(Cu,Zn)2 and Cu3.2Zn0.7Al4.2, were formed. The average shear strength of Al7075/Zn5Al3Cu/Cu joints attained was 134.5 MPa. For comparison, the Cu/Zn5Al3Cu/Cu joint attained an average shear strength of 136.5 MPa.
View Full-Text
Keywords:
soldering; ultrasonic; intermetallic compounds; shear strength
▼
Show Figures
Figure 1
This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited
MDPI and ACS Style
Kolenak, R.; Kostolny, I.; Drapala, J.; Babincova, P.; Sahul, M. Characterizing the Soldering Alloy Type Zn–Al–Cu and Study of Ultrasonic Soldering of Al7075/Cu Combination. Metals 2021, 11, 27. https://doi.org/10.3390/met11010027
AMA Style
Kolenak R, Kostolny I, Drapala J, Babincova P, Sahul M. Characterizing the Soldering Alloy Type Zn–Al–Cu and Study of Ultrasonic Soldering of Al7075/Cu Combination. Metals. 2021; 11(1):27. https://doi.org/10.3390/met11010027
Chicago/Turabian StyleKolenak, Roman, Igor Kostolny, Jaromir Drapala, Paulina Babincova, and Martin Sahul. 2021. "Characterizing the Soldering Alloy Type Zn–Al–Cu and Study of Ultrasonic Soldering of Al7075/Cu Combination" Metals 11, no. 1: 27. https://doi.org/10.3390/met11010027
Find Other Styles
Note that from the first issue of 2016, MDPI journals use article numbers instead of page numbers. See further details here.
