Research on Thermal Analysis and Enhanced Heat Dissipation Technology of Fully Enclosed Reinforced Computer

Fully enclosed reinforced computers typically need to adapt to harsh environments such as high temperature, humidity, and strong vibration. However, their physical hermeticity leads to a single heat dissipation method, and local overheating caused by high heat flux density components seriously threatens equipment reliability. To address this issue, this study first analyzed its structural characteristics and established a cross-scale simulation model of the chassis and board. Second, aiming at internal heat accumulation and local overheating at high temperatures, the problem was solved by optimizing the layout of components on the motherboard. For thermo-mechanical collaborative optimization of these components, a Pareto-max-min ant algorithm was designed, adopting dynamic state transition, hybrid local search, pheromone update, and Pareto solution set update strategies to obtain the Pareto frontier. The optimal solution was selected via the LINMAP decision method and simulated, and the optimal layout of the fan module was determined. Finally, a prototype was manufactured, and temperature field tests were conducted. Results show that at 25 °C~55 °C, all chips’ temperatures are below the allowable limit, with errors within 10% vs. simulation data, verifying the thermal simulation and design.