To explain the reason why using phenol-formaldehyde (PF) resin improves the water resistance of soy-based adhesive, the performance of soy-based adhesive cross-linked with hydroxymethyl phenol (HPF) and the reaction between HPF and a common dipeptide N
-glutamine (AG) being used as a model compound were studied in this paper. The DSC and DMA results indicated the reaction between HPF and soy-based adhesive. The soy-based adhesive cross-linked with HPF cured at a lower temperature than the adhesive without HPF. The former showed better mechanical performance and heat resistance than the latter. The ESI-MS, FT-IR and 13C-NMR results proved the reaction between HPF and AG. Because of the existence of branched ether groups in the 13
C-NMR results of HPF/AG, the reaction between HPF and AG might mainly happened between hydroxymethyl groups and amino groups under a basic condition.
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