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Journal: Polymers, 2025
Volume: 17
Number: 2688
Article:
Design of Residual Stress-Balanced Transferable Encapsulation Platform Using Urethane-Based Polymer Superstrate for Reliable Wearable Electronics
Authors:
by
Sung-Hun Jo, Donghwan Kim, Chaewon Park and Eun Gyo Jeong
Link:
https://www.mdpi.com/2073-4360/17/19/2688
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