Article Versions Notes

Ye M, Jiang J, Zhao L, Zhu H, Wang J, Sun Z, Zhang D, Li M, Zhang Y. Preparation of Phenolic Epoxy-Based Electronic Packaging Materials with High Thermal Conductivity by Creating an Interfacial Heat Conduction Network. Polymers. 2025; 17(11):1507. https://doi.org/10.3390/polym17111507

Ye, Minghao, Jing Jiang, Lin Zhao, Hongyu Zhu, Junjie Wang, Zicai Sun, Dewei Zhang, Ming Li, and Yagang Zhang. 2025. "Preparation of Phenolic Epoxy-Based Electronic Packaging Materials with High Thermal Conductivity by Creating an Interfacial Heat Conduction Network" Polymers 17, no. 11: 1507. https://doi.org/10.3390/polym17111507

Ye, M., Jiang, J., Zhao, L., Zhu, H., Wang, J., Sun, Z., Zhang, D., Li, M., & Zhang, Y. (2025). Preparation of Phenolic Epoxy-Based Electronic Packaging Materials with High Thermal Conductivity by Creating an Interfacial Heat Conduction Network. Polymers, 17(11), 1507. https://doi.org/10.3390/polym17111507