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Journal: Polymers, 2025
Volume: 17
Number: 50

Article: Analysis of Residual Stress at the Interface of Epoxy-Resin/Silicon-Wafer Composites During Thermal Aging
Authors: by Jianyu Wu, Fangzhou Chen, Jiahao Liu, Rui Chen, Peijiang Liu, Hao Zhao and Zhenbo Zhao
Link: https://www.mdpi.com/2073-4360/17/1/50

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