Next Article in Journal
Correction: Nimbalkar et al. A Review of Polymer Dielectrics for Redistribution Layers in Interposers and Package Substrates. Polymers 2023, 15, 3895
Previous Article in Journal
Encapsulation of Bacillus subtilis in Electrospun Poly(3-hydroxybutyrate) Fibers Coated with Cellulose Derivatives for Sustainable Agricultural Applications
 
 
Article

Article Versions Notes

Polymers 2024, 16(19), 2750; https://doi.org/10.3390/polym16192750
Action Date Notes Link
article xml file uploaded 28 September 2024 16:25 CEST Original file -
article xml uploaded. 28 September 2024 16:25 CEST Update -
article pdf uploaded. 28 September 2024 16:25 CEST Version of Record https://www.mdpi.com/2073-4360/16/19/2750/pdf-vor
article html file updated 28 September 2024 16:27 CEST Original file -
article xml file uploaded 12 October 2024 08:08 CEST Update -
article xml uploaded. 12 October 2024 08:08 CEST Update -
article pdf uploaded. 12 October 2024 08:08 CEST Updated version of record https://www.mdpi.com/2073-4360/16/19/2750/pdf-vor
article html file updated 12 October 2024 08:09 CEST Update -
article xml file uploaded 12 October 2024 08:11 CEST Update -
article xml uploaded. 12 October 2024 08:11 CEST Update -
article pdf uploaded. 12 October 2024 08:11 CEST Updated version of record https://www.mdpi.com/2073-4360/16/19/2750/pdf-vor
article html file updated 12 October 2024 08:12 CEST Update -
article xml file uploaded 12 October 2024 08:26 CEST Update -
article xml uploaded. 12 October 2024 08:26 CEST Update https://www.mdpi.com/2073-4360/16/19/2750/xml
article pdf uploaded. 12 October 2024 08:26 CEST Updated version of record https://www.mdpi.com/2073-4360/16/19/2750/pdf
article html file updated 12 October 2024 08:29 CEST Update https://www.mdpi.com/2073-4360/16/19/2750/html
Back to TopTop