Kalaš, D.; Šíma, K.; Kadlec, P.; Polanský, R.; Soukup, R.; Řeboun, J.; Hamáček, A.
FFF 3D Printing in Electronic Applications: Dielectric and Thermal Properties of Selected Polymers. Polymers 2021, 13, 3702.
https://doi.org/10.3390/polym13213702
AMA Style
Kalaš D, Šíma K, Kadlec P, Polanský R, Soukup R, Řeboun J, Hamáček A.
FFF 3D Printing in Electronic Applications: Dielectric and Thermal Properties of Selected Polymers. Polymers. 2021; 13(21):3702.
https://doi.org/10.3390/polym13213702
Chicago/Turabian Style
Kalaš, David, Karel Šíma, Petr Kadlec, Radek Polanský, Radek Soukup, Jan Řeboun, and Aleš Hamáček.
2021. "FFF 3D Printing in Electronic Applications: Dielectric and Thermal Properties of Selected Polymers" Polymers 13, no. 21: 3702.
https://doi.org/10.3390/polym13213702
APA Style
Kalaš, D., Šíma, K., Kadlec, P., Polanský, R., Soukup, R., Řeboun, J., & Hamáček, A.
(2021). FFF 3D Printing in Electronic Applications: Dielectric and Thermal Properties of Selected Polymers. Polymers, 13(21), 3702.
https://doi.org/10.3390/polym13213702