Mora, M.; Amaveda, H.; Porta-Velilla, L.; de la Fuente, G.F.; Martínez, E.; Angurel, L.A.
Improved Copper–Epoxy Adhesion by Laser Micro- and Nano-Structuring of Copper Surface for Thermal Applications. Polymers 2021, 13, 1721.
https://doi.org/10.3390/polym13111721
AMA Style
Mora M, Amaveda H, Porta-Velilla L, de la Fuente GF, Martínez E, Angurel LA.
Improved Copper–Epoxy Adhesion by Laser Micro- and Nano-Structuring of Copper Surface for Thermal Applications. Polymers. 2021; 13(11):1721.
https://doi.org/10.3390/polym13111721
Chicago/Turabian Style
Mora, Mario, Hippolyte Amaveda, Luis Porta-Velilla, Germán F. de la Fuente, Elena Martínez, and Luis A. Angurel.
2021. "Improved Copper–Epoxy Adhesion by Laser Micro- and Nano-Structuring of Copper Surface for Thermal Applications" Polymers 13, no. 11: 1721.
https://doi.org/10.3390/polym13111721
APA Style
Mora, M., Amaveda, H., Porta-Velilla, L., de la Fuente, G. F., Martínez, E., & Angurel, L. A.
(2021). Improved Copper–Epoxy Adhesion by Laser Micro- and Nano-Structuring of Copper Surface for Thermal Applications. Polymers, 13(11), 1721.
https://doi.org/10.3390/polym13111721