Article Versions Notes

Xu P, Liu S, Hao L, Zhang J, Wang Y, Tan Q, Wang C. An Efficient Numerical Homogenization Method for Multi-Scale Modeling of 2.5D Package Warpage and Thermal Analysis. Micromachines. 2026; 17(7):853. https://doi.org/10.3390/mi17070853

Xu, Pengying, Shaoyi Liu, Lu Hao, Jitang Zhang, Yan Wang, Qiulin Tan, and Congsi Wang. 2026. "An Efficient Numerical Homogenization Method for Multi-Scale Modeling of 2.5D Package Warpage and Thermal Analysis" Micromachines 17, no. 7: 853. https://doi.org/10.3390/mi17070853

Xu, P., Liu, S., Hao, L., Zhang, J., Wang, Y., Tan, Q., & Wang, C. (2026). An Efficient Numerical Homogenization Method for Multi-Scale Modeling of 2.5D Package Warpage and Thermal Analysis. Micromachines, 17(7), 853. https://doi.org/10.3390/mi17070853