Article Versions Notes

Li P, Yan X, Yang Y, Meng L, Zhang X, Wang H, Lu Q. A Wafer-Level Stacking Scheme Based on Hybrid Etching and Low-Temperature Bonding for High-Performance MEMS Devices. Micromachines. 2026; 17(6):651. https://doi.org/10.3390/mi17060651

Li, Pengfei, Xin Yan, Yunjie Yang, Leilei Meng, Xiwen Zhang, Haiyan Wang, and Qianbo Lu. 2026. "A Wafer-Level Stacking Scheme Based on Hybrid Etching and Low-Temperature Bonding for High-Performance MEMS Devices" Micromachines 17, no. 6: 651. https://doi.org/10.3390/mi17060651

Li, P., Yan, X., Yang, Y., Meng, L., Zhang, X., Wang, H., & Lu, Q. (2026). A Wafer-Level Stacking Scheme Based on Hybrid Etching and Low-Temperature Bonding for High-Performance MEMS Devices. Micromachines, 17(6), 651. https://doi.org/10.3390/mi17060651