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Article

Parameter Study on Force Curves of Assembled Electronic Components on Foils during Injection Overmolding Using Simulation

1
Polymer Processing, Department of Polymer Engineering and Science, Montanuniversitaet Leoben, 8700 Leoben, Austria
2
Center for Microsystems Technology, Ghent University, B-9052 Ghent, Belgium
3
Joanneum Research Forschungsgesellschaft mbH, Franz-Pichler Str. 30, 8160 Weiz, Austria
4
Designing Plastics and Composite Materials, Department of Polymer Engineering and Science, Montanuniversitaet Leoben, 8700 Leoben, Austria
5
Centre for Microsystems Technology, Imec and Ghent University, Technology Park 126, Zwijnaarde, B-9052 Ghent, Belgium
*
Authors to whom correspondence should be addressed.
Micromachines 2023, 14(4), 876; https://doi.org/10.3390/mi14040876
Submission received: 20 March 2023 / Revised: 11 April 2023 / Accepted: 14 April 2023 / Published: 19 April 2023
(This article belongs to the Special Issue Flexible and Wearable Sensors)

Abstract

The integration of assembled foils in injection-molded parts is a challenging step. Such assembled foils typically comprise a plastic foil on which a circuit board is printed and electronic components are mounted. Those components can detach during overmolding when high pressures and shear stresses prevail due to the injected viscous thermoplastic melt. Hence, the molding settings significantly impact such parts’ successful, damage-free manufacturing. In this paper, a virtual parameter study was performed using injection molding software in which 1206-sized components were overmolded in a plate mold using polycarbonate (PC). In addition, experimental injection molding tests of that design and shear and peel tests were made. The simulated forces increased with decreasing mold thickness and melt temperature and increasing injection speed. The calculated tangential forces in the initial stage of overmolding ranged from 1.3 N to 7.3 N, depending on the setting used. However, the experimental at room temperature-obtained shear forces at break were at least 22 N. Yet, detached components were present in most of the experimentally overmolded foils. Hence, the shear tests performed at room temperature can only provide limited information. In addition, there might be a peel-like load case during overmolding where the flexible foil might bend during overmolding.
Keywords: injection molding; simulation; in-mold electronics; over-molding; Moldflow injection molding; simulation; in-mold electronics; over-molding; Moldflow

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MDPI and ACS Style

Hubmann, M.; Bakr, M.; Groten, J.; Pletz, M.; Vanfleteren, J.; Bossuyt, F.; Madadnia, B.; Stadlober, B. Parameter Study on Force Curves of Assembled Electronic Components on Foils during Injection Overmolding Using Simulation. Micromachines 2023, 14, 876. https://doi.org/10.3390/mi14040876

AMA Style

Hubmann M, Bakr M, Groten J, Pletz M, Vanfleteren J, Bossuyt F, Madadnia B, Stadlober B. Parameter Study on Force Curves of Assembled Electronic Components on Foils during Injection Overmolding Using Simulation. Micromachines. 2023; 14(4):876. https://doi.org/10.3390/mi14040876

Chicago/Turabian Style

Hubmann, Martin, Mona Bakr, Jonas Groten, Martin Pletz, Jan Vanfleteren, Frederick Bossuyt, Behnam Madadnia, and Barbara Stadlober. 2023. "Parameter Study on Force Curves of Assembled Electronic Components on Foils during Injection Overmolding Using Simulation" Micromachines 14, no. 4: 876. https://doi.org/10.3390/mi14040876

APA Style

Hubmann, M., Bakr, M., Groten, J., Pletz, M., Vanfleteren, J., Bossuyt, F., Madadnia, B., & Stadlober, B. (2023). Parameter Study on Force Curves of Assembled Electronic Components on Foils during Injection Overmolding Using Simulation. Micromachines, 14(4), 876. https://doi.org/10.3390/mi14040876

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