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Journal: Micromachines, 2018
Volume: 9
Number: 181

Article: Bonding-Based Wafer-Level Vacuum Packaging Using Atomic Hydrogen Pre-Treated Cu Bonding Frames
Authors: by Koki Tanaka, Hideki Hirano, Masafumi Kumano, Joerg Froemel and Shuji Tanaka
Link: https://www.mdpi.com/2072-666X/9/4/181

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