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Journal: Micromachines, 2018
Volume: 9
Number: 174
Article:
Comprehensive Die Shear Test of Silicon Packages Bonded by Thermocompression of Al Layers with Thin Sn Capping or Insertions
Authors:
by
Shiro Satoh, Hideyuki Fukushi, Masayoshi Esashi and Shuji Tanaka
Link:
https://www.mdpi.com/2072-666X/9/4/174
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