Next Article in Journal
Microfabricated Vapor Cells with Reflective Sidewalls for Chip Scale Atomic Sensors
Next Article in Special Issue
Bonding-Based Wafer-Level Vacuum Packaging Using Atomic Hydrogen Pre-Treated Cu Bonding Frames
Previous Article in Journal
A Study on Measurement Variations in Resonant Characteristics of Electrostatically Actuated MEMS Resonators
Previous Article in Special Issue
Millimeter-Wave Substrate Integrated Waveguide Using Micromachined Tungsten-Coated Through Glass Silicon Via Structures
 
 

Order Article Reprints

Journal: Micromachines, 2018
Volume: 9
Number: 174

Article: Comprehensive Die Shear Test of Silicon Packages Bonded by Thermocompression of Al Layers with Thin Sn Capping or Insertions
Authors: by Shiro Satoh, Hideyuki Fukushi, Masayoshi Esashi and Shuji Tanaka
Link: https://www.mdpi.com/2072-666X/9/4/174

MDPI offers high quality article reprints with convenient shipping to destinations worldwide. Each reprint features a 270 gsm bright white cover and 105 gsm premium white paper, bound with two stitches for durability and printed in full color. The cover design is customized to your article and designed to be complimentary to the journal.

Order Cost and Details

Shipping Address

Billing Address

Notes or Comments

Validate and Place Order

The order must be prepaid after it is placed

req denotes required fields.
Back to TopTop