Next Article in Journal
A Study on Measurement Variations in Resonant Characteristics of Electrostatically Actuated MEMS Resonators
Next Article in Special Issue
Comprehensive Die Shear Test of Silicon Packages Bonded by Thermocompression of Al Layers with Thin Sn Capping or Insertions
Previous Article in Journal
Spiral Microchannels with Trapezoidal Cross Section Fabricated by Femtosecond Laser Ablation in Glass for the Inertial Separation of Microparticles
Previous Article in Special Issue
Wafer-Level Packaging Method for RF MEMS Applications Using Pre-Patterned BCB Polymer
 
 
Article

Article Versions Notes

Micromachines 2018, 9(4), 172; https://doi.org/10.3390/mi9040172
Action Date Notes Link
article pdf uploaded. 9 April 2018 11:22 CEST Version of Record https://www.mdpi.com/2072-666X/9/4/172/pdf
article xml uploaded. 9 April 2018 11:22 CEST Original file -
article xml uploaded. 9 April 2018 11:22 CEST Update https://www.mdpi.com/2072-666X/9/4/172/xml
article html file updated 9 April 2018 11:23 CEST Original file -
article html file updated 1 May 2018 13:06 CEST Update -
article html file updated 29 March 2019 13:54 CET Update -
article html file updated 17 April 2019 05:15 CEST Update -
article html file updated 1 May 2019 05:01 CEST Update -
article html file updated 2 October 2019 10:08 CEST Update -
article html file updated 9 February 2020 13:03 CET Update https://www.mdpi.com/2072-666X/9/4/172/html
Back to TopTop