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Micromachines 2017, 8(7), 219;

Nearly Aberration-Free Multiphoton Polymerization into Thick Photoresist Layers

Biological Research Centre, Institute of Biophysics, Hungarian Academy of Sciences, Temesvári krt. 62, 6726 Szeged, Hungary
Author to whom correspondence should be addressed.
Received: 22 May 2017 / Revised: 21 June 2017 / Accepted: 6 July 2017 / Published: 13 July 2017
(This article belongs to the Special Issue Ultrafast Laser Fabrication for Lab-on-a-Chip)
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In the era of lab-on-chip (LOC) devices, two-photon polymerization (TPP) is gaining more and more interest due to its capability of producing micrometer-sized 3D structures. With TPP, one may integrate functional structures into microfluidic systems by polymerizing them directly inside microchannels. When the feature of sub-micrometer size is a requirement, it is necessary to use high numerical aperture (NA) oil-immersion objectives that are optimized to work close to the glass substrate-photoresist interface. Further away from the substrate, that is, a few tens of micrometers into the photoresist, the focused beam undergoes focal spot elongation and focal position shift. These effects may eventually reduce the quality of the polymerized structures; therefore, it is desirable to eliminate them. We introduce a method that can highly improve the quality of structures polymerized tens of micrometers away from the substrate-photoresist interface by an oil-immersion, high NA objective. A spatial light-modulator is used to pre-compensate the phase-front distortion introduced by the interfacial refractive index jump on the strongly converging beam. View Full-Text
Keywords: laser materials processing; hybrid manufacturing; two-photon polymerization; spatial light modulator; spherical aberration laser materials processing; hybrid manufacturing; two-photon polymerization; spatial light modulator; spherical aberration

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Horváth, B.; Ormos, P.; Kelemen, L. Nearly Aberration-Free Multiphoton Polymerization into Thick Photoresist Layers. Micromachines 2017, 8, 219.

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