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Journal: Micromachines, 2011
Volume: 2
Number: 49

Article: Self-Assembly of Chip-Size Components with Cavity Structures: High-Precision Alignment and Direct Bonding without Thermal Compression for Hetero Integration
Authors: by Takafumi Fukushima, Takayuki Konno, Eiji Iwata, Risato Kobayashi, Toshiya Kojima, Mariappan Murugesan, Ji-Chel Bea, Kang-Wook Lee, Tetsu Tanaka and Mitsumasa Koyanagi
Link: https://www.mdpi.com/2072-666X/2/1/49

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