Order Article Reprints

Fukushima T, Konno T, Iwata E, Kobayashi R, Kojima T, Murugesan M, Bea J-C, Lee K-W, Tanaka T, Koyanagi M. Self-Assembly of Chip-Size Components with Cavity Structures: High-Precision Alignment and Direct Bonding without Thermal Compression for Hetero Integration. Micromachines. 2011; 2(1):49-68. https://doi.org/10.3390/mi2010049

Fukushima, Takafumi, Takayuki Konno, Eiji Iwata, Risato Kobayashi, Toshiya Kojima, Mariappan Murugesan, Ji-Chel Bea, Kang-Wook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi. 2011. "Self-Assembly of Chip-Size Components with Cavity Structures: High-Precision Alignment and Direct Bonding without Thermal Compression for Hetero Integration" Micromachines 2, no. 1: 49-68. https://doi.org/10.3390/mi2010049

Fukushima, T., Konno, T., Iwata, E., Kobayashi, R., Kojima, T., Murugesan, M., Bea, J.-C., Lee, K.-W., Tanaka, T., & Koyanagi, M. (2011). Self-Assembly of Chip-Size Components with Cavity Structures: High-Precision Alignment and Direct Bonding without Thermal Compression for Hetero Integration. Micromachines, 2(1), 49-68. https://doi.org/10.3390/mi2010049