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Journal: Micromachines, 2026
Volume: 17
Number: 853
853
Article: An Efficient Numerical Homogenization Method for Multi-Scale Modeling of 2.5D Package Warpage and Thermal Analysis
Authors: by Pengying Xu, Shaoyi Liu, Lu Hao, Jitang Zhang, Yan Wang, Qiulin Tan and Congsi Wang
Link: https://www.mdpi.com/2072-666X/17/7/853

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