Ha, H.; Kim, H.; Lee, S.; Choi, S.; Choi, C.; Yusoff, W.Y.W.; Shan, A.; Lim, S.; Hwang, B. Overview of Thermal Management Solution for 3D Integrated Circuits Using Carbon-Nanotube-Based Silicon Through-Vias. Micromachines 2025, 16, 968. https://doi.org/10.3390/mi16090968

AMA Style

Ha H, Kim H, Lee S, Choi S, Choi C, Yusoff WYW, Shan A, Lim S, Hwang B. Overview of Thermal Management Solution for 3D Integrated Circuits Using Carbon-Nanotube-Based Silicon Through-Vias. Micromachines. 2025; 16(9):968. https://doi.org/10.3390/mi16090968

Chicago/Turabian Style

Ha, Heebo, Hongju Kim, Sumin Lee, Sooyong Choi, Chunghyeon Choi, Wan Yusmawati Wan Yusoff, Ali Shan, Sooman Lim, and Byungil Hwang. 2025. "Overview of Thermal Management Solution for 3D Integrated Circuits Using Carbon-Nanotube-Based Silicon Through-Vias" Micromachines 16, no. 9: 968. https://doi.org/10.3390/mi16090968

APA Style

Ha, H., Kim, H., Lee, S., Choi, S., Choi, C., Yusoff, W. Y. W., Shan, A., Lim, S., & Hwang, B. (2025). Overview of Thermal Management Solution for 3D Integrated Circuits Using Carbon-Nanotube-Based Silicon Through-Vias. Micromachines, 16(9), 968. https://doi.org/10.3390/mi16090968

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