Wang, H.; Cao, Q.; Hou, Y.; Yu, L.; Wu, T.; Wang, Z.; Wang, D.
Integrated LCOS-SLM-Based Laser Slicing System for Aberration Correction in Silicon Carbide Substrate Manufacturing. Micromachines 2025, 16, 930.
https://doi.org/10.3390/mi16080930
AMA Style
Wang H, Cao Q, Hou Y, Yu L, Wu T, Wang Z, Wang D.
Integrated LCOS-SLM-Based Laser Slicing System for Aberration Correction in Silicon Carbide Substrate Manufacturing. Micromachines. 2025; 16(8):930.
https://doi.org/10.3390/mi16080930
Chicago/Turabian Style
Wang, Heng, Qiang Cao, Yuting Hou, Lulu Yu, Tianhao Wu, Zhenzhong Wang, and Du Wang.
2025. "Integrated LCOS-SLM-Based Laser Slicing System for Aberration Correction in Silicon Carbide Substrate Manufacturing" Micromachines 16, no. 8: 930.
https://doi.org/10.3390/mi16080930
APA Style
Wang, H., Cao, Q., Hou, Y., Yu, L., Wu, T., Wang, Z., & Wang, D.
(2025). Integrated LCOS-SLM-Based Laser Slicing System for Aberration Correction in Silicon Carbide Substrate Manufacturing. Micromachines, 16(8), 930.
https://doi.org/10.3390/mi16080930