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Journal: Micromachines, 2025
Volume: 16
Number: 908
Article:
Design and Fabrication of Embedded Microchannel Cooling Solutions for High-Power-Density Semiconductor Devices
Authors:
by
Yu Fu, Guangbao Shan, Xiaofei Zhang, Lizheng Zhao and Yintang Yang
Link:
https://www.mdpi.com/2072-666X/16/8/908
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