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Journal: Micromachines, 2025
Volume: 16
Number: 908

Article: Design and Fabrication of Embedded Microchannel Cooling Solutions for High-Power-Density Semiconductor Devices
Authors: by Yu Fu, Guangbao Shan, Xiaofei Zhang, Lizheng Zhao and Yintang Yang
Link: https://www.mdpi.com/2072-666X/16/8/908

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