Cai, K.; Xiao, J.; Su, X.; Tang, Q.; Deng, H.
Encapsulation Process and Dynamic Characterization of SiC Half-Bridge Power Module: Electro-Thermal Co-Design and Experimental Validation. Micromachines 2025, 16, 824.
https://doi.org/10.3390/mi16070824
AMA Style
Cai K, Xiao J, Su X, Tang Q, Deng H.
Encapsulation Process and Dynamic Characterization of SiC Half-Bridge Power Module: Electro-Thermal Co-Design and Experimental Validation. Micromachines. 2025; 16(7):824.
https://doi.org/10.3390/mi16070824
Chicago/Turabian Style
Cai, Kaida, Jing Xiao, Xingwei Su, Qiuhui Tang, and Huayuan Deng.
2025. "Encapsulation Process and Dynamic Characterization of SiC Half-Bridge Power Module: Electro-Thermal Co-Design and Experimental Validation" Micromachines 16, no. 7: 824.
https://doi.org/10.3390/mi16070824
APA Style
Cai, K., Xiao, J., Su, X., Tang, Q., & Deng, H.
(2025). Encapsulation Process and Dynamic Characterization of SiC Half-Bridge Power Module: Electro-Thermal Co-Design and Experimental Validation. Micromachines, 16(7), 824.
https://doi.org/10.3390/mi16070824