Chu, X.; Wang, S.; Li, C.; Wang, Z.; Ma, S.; Wu, D.; Yuan, H.; You, B.
Modeling and Simulation for Predicting Thermo-Mechanical Behavior of Wafer-Level Cu-PI RDLs During Manufacturing. Micromachines 2025, 16, 582.
https://doi.org/10.3390/mi16050582
AMA Style
Chu X, Wang S, Li C, Wang Z, Ma S, Wu D, Yuan H, You B.
Modeling and Simulation for Predicting Thermo-Mechanical Behavior of Wafer-Level Cu-PI RDLs During Manufacturing. Micromachines. 2025; 16(5):582.
https://doi.org/10.3390/mi16050582
Chicago/Turabian Style
Chu, Xianglong, Shitao Wang, Chunlei Li, Zhizhen Wang, Shenglin Ma, Daowei Wu, Hai Yuan, and Bin You.
2025. "Modeling and Simulation for Predicting Thermo-Mechanical Behavior of Wafer-Level Cu-PI RDLs During Manufacturing" Micromachines 16, no. 5: 582.
https://doi.org/10.3390/mi16050582
APA Style
Chu, X., Wang, S., Li, C., Wang, Z., Ma, S., Wu, D., Yuan, H., & You, B.
(2025). Modeling and Simulation for Predicting Thermo-Mechanical Behavior of Wafer-Level Cu-PI RDLs During Manufacturing. Micromachines, 16(5), 582.
https://doi.org/10.3390/mi16050582
