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Journal: Micromachines, 2025
Volume: 16
Number: 488

Article: Interposer-Based ESD Protection: A Potential Solution for μ-Packaging Reliability of 3D Chips
Authors: by Xunyu Li, Zijin Pan, Weiquan Hao, Runyu Miao, Zijian Yue and Albert Wang
Link: https://www.mdpi.com/2072-666X/16/4/488

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