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Journal: Micromachines, 2025
Volume: 16
Number: 431

Article: Electronic Chip Package and Co-Packaged Optics (CPO) Technology for Modern AI Era: A Review
Authors: by Guoliang Chen, Guiqi Wang, Zhenzhen Wang and Lijun Wang
Link: https://www.mdpi.com/2072-666X/16/4/431

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