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Journal: Micromachines, 2025
Volume: 16
Number: 428
428
Article: An Overview of Substrate Copper Trace Crack Through Experiments, Characterization, and Numerical Simulations
Authors: by Wei Yu, Faxing Che, Vance Liu, Raymond Chen, Sam Ireland, Yeow Chon Ong, Hong Wan Ng and Gokul Kumar
Link: https://www.mdpi.com/2072-666X/16/4/428

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