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Journal: Micromachines, 2025
Volume: 16
Number: 320

Article: A Review of Wafer-Level Packaging Technology for SAW and BAW Filters
Authors: by Xinyue Liu, Wenjiao Pei, Jin Zhao, Rongbin Xu, Yi Zhong and Daquan Yu
Link: https://www.mdpi.com/2072-666X/16/3/320

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