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Journal: Micromachines, 2025
Volume: 16
Number: 121

Article: The Effect of BEOL Design Factors on the Thermal Reliability of Flip-Chip Chip-Scale Packaging
Authors: by Dejian Li, Bofu Li, Shunfeng Han, Dameng Li, Baobin Yang, Baoliang Gong, Zhangzhang Zhang, Chang Yu and Pei Chen
Link: https://www.mdpi.com/2072-666X/16/2/121

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