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Journal: Micromachines, 2025
Volume: 16
Number: 1403

Article: An Effective Hybrid Rescheduling Method for Wafer Chip Precision Packaging Workshops in Complex Manufacturing Environments
Authors: by Ziyue Wang, Weikang Fang and Yichen Yang
Link: https://www.mdpi.com/2072-666X/16/12/1403

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