A High-Performance Ordered Routing Algorithm for Large-Scale WLCSP with Multi-Capacity †
Abstract
1. Introduction
1.1. Previous Work
1.2. Our Contributions
- We use the MMCF model and LP method to solve the fan-out WLCSP I/O ordered routing problem. The LP method has polynomial time complexity, which is faster than the traditional ILP solver, for dealing with ordered routing problems. Then, we use the DFS to process the LP flow results to obtain candidate paths.
- We propose a crossing weight heuristic algorithm to solve the problem of path crossings. It can quickly obtain legal routing results that conform to the ordered routing constraints. We set the capacity of tile nodes and edges that have completed the routing path to 0. It solves the problem where the follow-up path crosses the completed routing path in iterative routing.
- Experimental results demonstrate that our algorithm can solve fan-out WLCSP ordered routing problems with twice the scale and reduce routing time by 17% when handling multi-capacity ordered routing problems. The performance advantage of our algorithm becomes more evident as the routing capacity and scale increase.
2. Preliminaries
2.1. Problem Formulation
- Different I/O paths cannot cross each other.
- When routing, I/O must follow the preset order to reach the boundary bumps.
- The capacity consumed when routing must be less than the set tile node and tile edge capacity limits.
2.2. Ordering Constraints
2.3. Min-Cost Multi-Commodity Flow Model (MMCF Model)
3. Our Algorithm
3.1. Model Construction
3.1.1. Single-Capacity Model Construction
3.1.2. Multi-Capacity Model Optimization
3.1.3. Model Compactness
3.2. Preliminary Routing
3.2.1. Fan-Out Ordered Routing ILP Solution
3.2.2. Fan-Out Ordered Routing LP Solution
3.2.3. Ordered Routing Candidate Result Generation
3.3. Path Choosing
| Algorithm 1 DFS |
|
3.3.1. Crossings in MMCF Model Introduction
3.3.2. MMCF Non-Crossing Constraint Solution
| Algorithm 2 Optimize Path Set |
|
3.3.3. Iterative Routing Settings
3.3.4. Discussion on Computational Cost
4. Experimental Results
4.1. Results and Comparisons
4.2. Analysis of Routing Time
4.3. Analysis of Routing Length
4.4. Runtime Breakdown Analysis
5. Conclusions
6. Outlook
Author Contributions
Funding
Data Availability Statement
Conflicts of Interest
References
- Chen, C.; Lv, P.; Liu, Q.; Lin, D.; Lin, Z. A High-Performance Ordered Routing Algorithm for Large-Scale WLCSP with Multi-Capacity. In Proceedings of the 2024 6th International Academic Exchange Conference on Science and Technology Innovation (IAECST), Guangzhou, China, 6–8 December 2024; pp. 36–41. [Google Scholar]
- Lim, T.G.; Ho, D.S.W.; Ching, E.W.L.; Chen, Z.; Bhattacharya, S. FOWLP Design for Digital and RF Circuits. In Proceedings of the 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, USA, 28–31 May 2019; pp. 917–923. [Google Scholar]
- Guan, L.T.; Fai, C.K.; Soon Wee, D.H. FOWLP electrical performances. In Proceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC), Singapore, 30 November–3 December 2016; pp. 79–84. [Google Scholar]
- Vardaman, E.J. FO-WLP market and technology trends. In Proceedings of the 2017 International Conference on Electronics Packaging (ICEP), Yamagata, Japan, 19–22 April 2017; pp. 318–320. [Google Scholar]
- Garrou, P. Wafer level chip scale packaging (WL-CSP): An overview. IEEE Trans. Adv. Packag. 2000, 23, 198–205. [Google Scholar] [CrossRef]
- Hsueh, Y.T.; Chang, H.D.; Tseng, W.; Lin, C.F.; Chung, C.K. The challenge of Fan-out WLP in different process flow. In Proceedings of the 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), Taipei, Taiwan, 24–26 October 2018; pp. 47–50. [Google Scholar]
- Lin, B.Q.; Lin, T.C.; Chang, Y.W. Redistribution layer routing for integrated fan-out wafer-level chip-scale packages. In Proceedings of the 2016 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), Austin, TX, USA, 7–10 November 2016; pp. 1–8. [Google Scholar]
- Fang, J.W.; Lin, I.J.; Chang, Y.W.; Wang, J.H. A Network-Flow-Based RDL Routing Algorithmz for Flip-Chip Design. IEEE Trans.-Comput.-Aided Des. Integr. Circuits Syst. 2007, 26, 1417–1429. [Google Scholar] [CrossRef]
- Fang, J.W.; Hsu, C.H.; Chang, Y.W. An Integer-Linear-Programming-Based Routing Algorithm for Flip-Chip Designs. IEEE Trans.-Comput.-Aided Des. Integr. Circuits Syst. 2009, 28, 98–110. [Google Scholar] [CrossRef]
- Lin, C.W.; Lee, P.W.; Chang, Y.W.; Shen, C.F.; Tseng, W.C. An Efficient Pre-Assignment Routing Algorithm for Flip-Chip Designs. IEEE Trans.-Comput.-Aided Des. Integr. Circuits Syst. 2009, 31, 878–889. [Google Scholar] [CrossRef]
- Chen, Z.; Ji, W.; Peng, Y.; Chen, D.; Liu, M.; Yao, H. Machine Learning Based Acceleration Method for Ordered Escape Routing. In Proceedings of the 2021 Great Lakes Symposium on VLSI (GLSVLSI), Knoxville, TN, USA, 5–7 June 2021; pp. 365–370. [Google Scholar]
- Ahuja, R.K.; Magnanti, T.L.; Orlin, J.B. Network Flows: Theory, Algorithms, and Applications. Transp. Sci. 1994, 28, 354–356. [Google Scholar]
- Jiao, F.; Dong, S. Ordered Escape routing for grid pin array based on Min-cost Multi-commodity Flow. In Proceedings of the 2016 21st Asia and South Pacific Design Automation Conference (ASP-DAC), Macao, 25–28 January 2016; pp. 384–389. [Google Scholar]
- Gao, Z.; Dong, S.; Tang, Z.; Yu, W. MC-MCF: A Multi-Capacity Model for Ordered Escape Routing. In Proceedings of the 2023 24th International Symposium on Quality Electronic Design (ISQED), San Francisco, CA, USA, 5–7 April 2023; pp. 1–7. [Google Scholar]
- Ma, Q.; Wong, M.D.F. NP-completeness and an approximation algorithm for rectangle escape problem with application to PCB routing. IEEE Trans.-Comput.-Aided Des. Integr. Circuits Syst. 2012, 31, 1356–1365. [Google Scholar] [CrossRef]
- Gurobi Optimizer. Website. Available online: http://www.gurobi.com (accessed on 23 November 2025).
- Liao, Z.; Dong, S. A Constraint-Driven Compact Model with Partition Strategy for Ordered Escape Routing. In Proceedings of the 2020 Great Lakes Symposium on VLSI (GLSVLSI), Knoxville, TN, USA, 5–7 June 2020; pp. 393–398. [Google Scholar]













| Symbols and Descriptions | Abbreviations and Full Names | ||
|---|---|---|---|
| Network flow model | WLCSP | Wafer-level chip-scale packaging | |
| Fan-out bump with order i | ILP | integer linear programming | |
| N | Number of pre-assignment I/Os | RDL | redistribution layer |
| u | Tile node | MMCF | min-cost multi-commodity flow |
| Internal boundary node | LP | linear programming | |
| Internal filling node | DFS | depth-first search | |
| Internal edge | IC | integrated circuit | |
| Edge from node q to r | FA routing | free-assignment routing | |
| Flow of I/O k in edge | PA routing | pre-assignment routing | |
| Cost of tile edge | UA routing | unified-assignment routing | |
| Q | Cost of internal edge | ||
| Capacity of edge | |||
| Capacity of node r | |||
| , | Source and sink nodes | ||
| Boundary edge from to | |||
| Set of all paths | |||
| Total crossing weights of set | |||
| edge crossing weight | |||
| node crossing weight | |||
| Cases | Cols | Rows | I/Os | Type | ILP | ILP(ConDri(P)) | Our Method | ||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Length | Time (s) | Ratio (%) | Length | Time (s) | Ratio (%) | Length | Time (s) | Ratio (%) | |||||
| Case 1 | 8 | 6 | 10 | 3-side | 19 | 0.13 | 100% | 20 | 0.53 | 100% | 20 | 0.58 | 100% |
| Case 2 | 20 | 21 | 42 | 4-side | 76 | 64.87 | 100% | 78 | 4.87 | 100% | 78 | 31.96 | 100% |
| Case 3 | 30 | 30 | 100 | 4-side | / | / | / | 720 | 32.65 | 100% | 725 | 21.29 | 100% |
| Case 4 | 100 | 100 | 320 | 4-side | / | / | / | / | / | / | 6168 | 146.92 | 100% |
| Cases | Cols | Rows | I/Os | Capacity | MC-MCF | MC-MCF (WRDPS) | Our Method | ||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Length | Time (s) | Ratio (%) | Length | Time (s) | Ratio (%) | Length | Time (s) | Ratio (%) | |||||
| Case 5 | 8 | 8 | 43 | 2 | 98 | 45,895 | 100% | 98 | 183 | 100% | 105 | 180 | 100% |
| Case 6 | 10 | 10 | 32 | 2 | / | / | / | 90 | 158 | 100% | 93 | 163 | 100% |
| Case 7 | 11 | 11 | 70 | 4 | / | / | / | / | / | / | 255 | 220 | 100% |
| Case 8 | 20 | 20 | 171 | 4 | / | / | / | 470 | 746 | 100% | 484 | 648 | 100% |
| Case 9 | 23 | 24 | 93 | 2 | / | / | / | 338 | 206 | 100% | 340 | 172 | 100% |
| Case 10 | 24 | 24 | 93 | 2 | / | / | / | 413 | 1171 | 100% | 416 | 896 | 100% |
| Case 11 | 30 | 30 | 158 | 3 | / | / | / | 641 | 360 | 100% | 641 | 255 | 100% |
| Case 12 | 50 | 50 | 300 | 2 | / | / | / | 1617 | 2032 | 100% | 1652 | 1264 | 100% |
Disclaimer/Publisher’s Note: The statements, opinions and data contained in all publications are solely those of the individual author(s) and contributor(s) and not of MDPI and/or the editor(s). MDPI and/or the editor(s) disclaim responsibility for any injury to people or property resulting from any ideas, methods, instructions or products referred to in the content. |
© 2025 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/).
Share and Cite
Chen, C.; Lin, D.; Liu, Q.; Lin, Z. A High-Performance Ordered Routing Algorithm for Large-Scale WLCSP with Multi-Capacity. Micromachines 2025, 16, 1352. https://doi.org/10.3390/mi16121352
Chen C, Lin D, Liu Q, Lin Z. A High-Performance Ordered Routing Algorithm for Large-Scale WLCSP with Multi-Capacity. Micromachines. 2025; 16(12):1352. https://doi.org/10.3390/mi16121352
Chicago/Turabian StyleChen, Chuandong, Dishi Lin, Qinghai Liu, and Zhifeng Lin. 2025. "A High-Performance Ordered Routing Algorithm for Large-Scale WLCSP with Multi-Capacity" Micromachines 16, no. 12: 1352. https://doi.org/10.3390/mi16121352
APA StyleChen, C., Lin, D., Liu, Q., & Lin, Z. (2025). A High-Performance Ordered Routing Algorithm for Large-Scale WLCSP with Multi-Capacity. Micromachines, 16(12), 1352. https://doi.org/10.3390/mi16121352

