Next Article in Journal
Multiscale Modeling of Thermo–Electro–Mechanical Coupling of BGA Solder Joints in Microelectronic Systems of Ruggedized Computers for Signal Integrity Analysis
Next Article in Special Issue
Design and Experimental Validation of a Round Inductosyn-Based Angular Measurement System
Previous Article in Journal
Development of Vacuum-Chamber-Type Capacitive Micro-Pressure Sensors
Previous Article in Special Issue
Recent Advances in Electromagnetic Devices: Design and Optimization
 
 
Article

Article Versions Notes

Micromachines 2025, 16(11), 1291; https://doi.org/10.3390/mi16111291
Action Date Notes Link
article html file updated 18 November 2025 10:45 CET Update https://www.mdpi.com/2072-666X/16/11/1291/html
article pdf uploaded. 18 November 2025 10:42 CET Updated version of record https://www.mdpi.com/2072-666X/16/11/1291/pdf
article xml uploaded. 18 November 2025 10:42 CET Update https://www.mdpi.com/2072-666X/16/11/1291/xml
article xml file uploaded 18 November 2025 10:42 CET Update -
article html file updated 18 November 2025 08:54 CET Original file -
article pdf uploaded. 18 November 2025 08:52 CET Version of Record -
article xml uploaded. 18 November 2025 08:52 CET Update -
article xml file uploaded 18 November 2025 08:52 CET Original file -
Back to TopTop