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Journal: Micromachines, 2024
Volume: 15
Number: 1087
1087
Article: Residual Stress and Warping Analysis of the Nano-Silver Pressureless Sintering Process in SiC Power Device Packaging
Authors: by Wenchao Tian, Dexin Li, Haojie Dang, Shiqian Liang, Yizheng Zhang, Xiaojun Zhang, Si Chen and Xiaochuan Yu
Link: https://www.mdpi.com/2072-666X/15/9/1087

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