Ren, N.; Zhang, Y.; Shu, W.; Lu, C.; Zhang, W.; Chen, Z.; Wang, F.
Impact of Hydrogen Voiding in Chip-to-Chip Electroless All-Copper Interconnections. Micromachines 2024, 15, 612.
https://doi.org/10.3390/mi15050612
AMA Style
Ren N, Zhang Y, Shu W, Lu C, Zhang W, Chen Z, Wang F.
Impact of Hydrogen Voiding in Chip-to-Chip Electroless All-Copper Interconnections. Micromachines. 2024; 15(5):612.
https://doi.org/10.3390/mi15050612
Chicago/Turabian Style
Ren, Nana, Yuyi Zhang, Wenlong Shu, Chenxiao Lu, Wenjing Zhang, Zhuo Chen, and Fuliang Wang.
2024. "Impact of Hydrogen Voiding in Chip-to-Chip Electroless All-Copper Interconnections" Micromachines 15, no. 5: 612.
https://doi.org/10.3390/mi15050612
APA Style
Ren, N., Zhang, Y., Shu, W., Lu, C., Zhang, W., Chen, Z., & Wang, F.
(2024). Impact of Hydrogen Voiding in Chip-to-Chip Electroless All-Copper Interconnections. Micromachines, 15(5), 612.
https://doi.org/10.3390/mi15050612