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Journal: Micromachines, 2024
Volume: 15
Number: 323

Article: Analysis and Verification of Heat Dissipation Structures Embedded in Substrates in Power Chips Based on Square Frustums Thermal through Silicon Vias
Authors: by Fengjie Guo, Kui Ma, Jingyang Ran and Fashun Yang
Link: https://www.mdpi.com/2072-666X/15/3/323

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