Qian, J.; Shi, L.; Jin, M.; Bhattacharya, M.; Shimbori, A.; Yu, H.; Houshmand, S.; White, M.H.; Agarwal, A.K.
An Investigation of Body Diode Reliability in Commercial 1.2 kV SiC Power MOSFETs with Planar and Trench Structures. Micromachines 2024, 15, 177.
https://doi.org/10.3390/mi15020177
AMA Style
Qian J, Shi L, Jin M, Bhattacharya M, Shimbori A, Yu H, Houshmand S, White MH, Agarwal AK.
An Investigation of Body Diode Reliability in Commercial 1.2 kV SiC Power MOSFETs with Planar and Trench Structures. Micromachines. 2024; 15(2):177.
https://doi.org/10.3390/mi15020177
Chicago/Turabian Style
Qian, Jiashu, Limeng Shi, Michael Jin, Monikuntala Bhattacharya, Atsushi Shimbori, Hengyu Yu, Shiva Houshmand, Marvin H. White, and Anant K. Agarwal.
2024. "An Investigation of Body Diode Reliability in Commercial 1.2 kV SiC Power MOSFETs with Planar and Trench Structures" Micromachines 15, no. 2: 177.
https://doi.org/10.3390/mi15020177
APA Style
Qian, J., Shi, L., Jin, M., Bhattacharya, M., Shimbori, A., Yu, H., Houshmand, S., White, M. H., & Agarwal, A. K.
(2024). An Investigation of Body Diode Reliability in Commercial 1.2 kV SiC Power MOSFETs with Planar and Trench Structures. Micromachines, 15(2), 177.
https://doi.org/10.3390/mi15020177
