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Journal: Micromachines, 2023
Volume: 14
Number: 1728
Article:
Fabrication of µFFE Devices in COC via Hot Embossing with a 3D-Printed Master Mold
Authors:
by
Matthew B. LeMon, Cecilia C. Douma, Gretchen S. Burke and Michael T. Bowser
Link:
https://www.mdpi.com/2072-666X/14/9/1728
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