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Journal: Micromachines, 2023
Volume: 14
Number: 1695
1695
Article: Failure Analysis for Gold Wire Bonding of Sensor Packaging Based on Experimental and Numerical Methods
Authors: by Yameng Sun, Kun Ma, Yifan Song, Tongtong Zi, Xun Liu, Zheng Feng, Yang Zhou and Sheng Liu
Link: https://www.mdpi.com/2072-666X/14/9/1695

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