Bie, X.; Xiong, X.; Wang, Z.; Yang, W.; Li, Z.; Zou, X.
Analysis of the Thermally Induced Packaging Effects on the Frequency Drift of Micro-Electromechanical System Resonant Accelerometer. Micromachines 2023, 14, 1556.
https://doi.org/10.3390/mi14081556
AMA Style
Bie X, Xiong X, Wang Z, Yang W, Li Z, Zou X.
Analysis of the Thermally Induced Packaging Effects on the Frequency Drift of Micro-Electromechanical System Resonant Accelerometer. Micromachines. 2023; 14(8):1556.
https://doi.org/10.3390/mi14081556
Chicago/Turabian Style
Bie, Xiaorui, Xingyin Xiong, Zheng Wang, Wuhao Yang, Zhitian Li, and Xudong Zou.
2023. "Analysis of the Thermally Induced Packaging Effects on the Frequency Drift of Micro-Electromechanical System Resonant Accelerometer" Micromachines 14, no. 8: 1556.
https://doi.org/10.3390/mi14081556
APA Style
Bie, X., Xiong, X., Wang, Z., Yang, W., Li, Z., & Zou, X.
(2023). Analysis of the Thermally Induced Packaging Effects on the Frequency Drift of Micro-Electromechanical System Resonant Accelerometer. Micromachines, 14(8), 1556.
https://doi.org/10.3390/mi14081556