Yang, H.; Liu, M.; Zhu, Y.; Wang, W.; Qin, X.; He, L.; Jiang, K.
Characterization of Residual Stress in SOI Wafers by Using MEMS Cantilever Beams. Micromachines 2023, 14, 1510.
https://doi.org/10.3390/mi14081510
AMA Style
Yang H, Liu M, Zhu Y, Wang W, Qin X, He L, Jiang K.
Characterization of Residual Stress in SOI Wafers by Using MEMS Cantilever Beams. Micromachines. 2023; 14(8):1510.
https://doi.org/10.3390/mi14081510
Chicago/Turabian Style
Yang, Haotian, Min Liu, Yingmin Zhu, Weidong Wang, Xianming Qin, Lilong He, and Kyle Jiang.
2023. "Characterization of Residual Stress in SOI Wafers by Using MEMS Cantilever Beams" Micromachines 14, no. 8: 1510.
https://doi.org/10.3390/mi14081510
APA Style
Yang, H., Liu, M., Zhu, Y., Wang, W., Qin, X., He, L., & Jiang, K.
(2023). Characterization of Residual Stress in SOI Wafers by Using MEMS Cantilever Beams. Micromachines, 14(8), 1510.
https://doi.org/10.3390/mi14081510