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Journal: Micromachines, 2023
Volume: 14
Number: 1149
Article:
A Review of System-in-Package Technologies: Application and Reliability of Advanced Packaging
Authors:
by
Haoyu Wang, Jianshe Ma, Yide Yang, Mali Gong and Qinheng Wang
Link:
https://www.mdpi.com/2072-666X/14/6/1149
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