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Journal: Micromachines, 2023
Volume: 14
Number: 1149

Article: A Review of System-in-Package Technologies: Application and Reliability of Advanced Packaging
Authors: by Haoyu Wang, Jianshe Ma, Yide Yang, Mali Gong and Qinheng Wang
Link: https://www.mdpi.com/2072-666X/14/6/1149

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