Zhang, Y.; Wu, Y.; Sun, Q.; Shen, L.; Lan, J.; Guo, L.; Shen, Z.; Wang, X.; Xiao, J.; Xu, J.
Inductively Coupled Plasma Dry Etching of Silicon Deep Trenches with Extremely Vertical Smooth Sidewalls Used in Micro-Optical Gyroscopes. Micromachines 2023, 14, 846.
https://doi.org/10.3390/mi14040846
AMA Style
Zhang Y, Wu Y, Sun Q, Shen L, Lan J, Guo L, Shen Z, Wang X, Xiao J, Xu J.
Inductively Coupled Plasma Dry Etching of Silicon Deep Trenches with Extremely Vertical Smooth Sidewalls Used in Micro-Optical Gyroscopes. Micromachines. 2023; 14(4):846.
https://doi.org/10.3390/mi14040846
Chicago/Turabian Style
Zhang, Yuyu, Yu Wu, Quanquan Sun, Lifeng Shen, Jie Lan, Lingxi Guo, Zhenfeng Shen, Xuefang Wang, Junfeng Xiao, and Jianfeng Xu.
2023. "Inductively Coupled Plasma Dry Etching of Silicon Deep Trenches with Extremely Vertical Smooth Sidewalls Used in Micro-Optical Gyroscopes" Micromachines 14, no. 4: 846.
https://doi.org/10.3390/mi14040846
APA Style
Zhang, Y., Wu, Y., Sun, Q., Shen, L., Lan, J., Guo, L., Shen, Z., Wang, X., Xiao, J., & Xu, J.
(2023). Inductively Coupled Plasma Dry Etching of Silicon Deep Trenches with Extremely Vertical Smooth Sidewalls Used in Micro-Optical Gyroscopes. Micromachines, 14(4), 846.
https://doi.org/10.3390/mi14040846
