Research on MEMS Solid-State Fuse Logic Control Chip Based on Electrical Explosion Effect

Su, Wenting; Lou, Wenzhong; Feng, Hengzhen; Zhao, Yuecen; Lv, Sining; Kan, Wenxing; He, Bo

doi:10.3390/mi14030695

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Research on MEMS Solid-State Fuse Logic Control Chip Based on Electrical Explosion Effect

by

Wenting Su

¹,

Wenzhong Lou

^1,*,

Hengzhen Feng

^1,*

,

Yuecen Zhao

^2,3,*,

Sining Lv

¹,

Wenxing Kan

¹ and

Bo He

¹

Science and Technology on Electromechanical Dynamic Control Laboratory, School of Mechatronical Engineering, Beijing Institute of Technology, Beijing 100081, China

²

National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Shanghai Jiao Tong University, Shanghai 200240, China

³

School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Dong Chuan Road 800, Shanghai 200240, China

^*

Authors to whom correspondence should be addressed.

Micromachines 2023, 14(3), 695; https://doi.org/10.3390/mi14030695

Submission received: 28 December 2022 / Revised: 7 March 2023 / Accepted: 8 March 2023 / Published: 21 March 2023

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Abstract

A microelectromechanical systems (MEMS) solid-state logic control chip with three layers—diversion layer, control layer, and substrate layer—is designed to satisfy fuse miniaturization and integration requirements. A mathematical model is established according to the heat conduction equation, and the limit conditions of different structures are presented. The finite element multi-physical field simulation method is used to simulate the size and the action voltage of the diversion layer of the control chip. Based on the surface silicon process, fuse processing, and testing with the MEMS solid-state fuse-logic control chip, a diversion layer constant current, maximum current resistance test, and a control layer of different bridge area sizes, the bridge area size is 200 × 30 μm, and the minimum electrical explosion voltage is 23.6 V. The theoretical calculation results at 20 V and 100 μF demonstrate that the capacitor energy is insufficient to support the complete vaporization of the bridge area, but can be partially vaporized, consistent with the experimental results.

Keywords: MEMS; solid-state fuse logic control chip; metal bridge; solid-state ON–OFF switch

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MDPI and ACS Style

Su, W.; Lou, W.; Feng, H.; Zhao, Y.; Lv, S.; Kan, W.; He, B. Research on MEMS Solid-State Fuse Logic Control Chip Based on Electrical Explosion Effect. Micromachines 2023, 14, 695. https://doi.org/10.3390/mi14030695

AMA Style

Su W, Lou W, Feng H, Zhao Y, Lv S, Kan W, He B. Research on MEMS Solid-State Fuse Logic Control Chip Based on Electrical Explosion Effect. Micromachines. 2023; 14(3):695. https://doi.org/10.3390/mi14030695

Chicago/Turabian Style

Su, Wenting, Wenzhong Lou, Hengzhen Feng, Yuecen Zhao, Sining Lv, Wenxing Kan, and Bo He. 2023. "Research on MEMS Solid-State Fuse Logic Control Chip Based on Electrical Explosion Effect" Micromachines 14, no. 3: 695. https://doi.org/10.3390/mi14030695

APA Style

Su, W., Lou, W., Feng, H., Zhao, Y., Lv, S., Kan, W., & He, B. (2023). Research on MEMS Solid-State Fuse Logic Control Chip Based on Electrical Explosion Effect. Micromachines, 14(3), 695. https://doi.org/10.3390/mi14030695

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Research on MEMS Solid-State Fuse Logic Control Chip Based on Electrical Explosion Effect

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