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Journal: Micromachines, 2023
Volume: 14
Number: 290
Article:
Bottom-Up Cu Filling of High-Aspect-Ratio through-Diamond vias for 3D Integration in Thermal Management
Authors:
by
Kechen Zhao, Jiwen Zhao, Xiaoyun Wei, Xiaoyu Guan, Chaojun Deng, Bing Dai and Jiaqi Zhu
Link:
https://www.mdpi.com/2072-666X/14/2/290
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