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Journal: Micromachines, 2023
Volume: 14
Number: 1956
1956
Article: Research on Packaging Reliability and Quality Factor Degradation Model for Wafer-Level Vacuum Sealing MEMS Gyroscopes
Authors: by Yingyu Xu, Shuibin Liu, Chunhua He, Heng Wu, Lianglun Cheng, Qinwen Huang and Guizhen Yan
Link: https://www.mdpi.com/2072-666X/14/10/1956

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