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Journal: Micromachines, 2023
Volume: 14
Number: 1885

Article: Capillary Underfill Flow Simulation as a Design Tool for Flow-Optimized Encapsulation in Heterogenous Integration
Authors: by Lisa Christin Stencel, Jörg Strogies, Bernd Müller, Rüdiger Knofe, Carsten Borwieck and Matthias Heimann
Link: https://www.mdpi.com/2072-666X/14/10/1885

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