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Journal: Micromachines, 2022
Volume: 13
Number: 1539

Article: Promotion of High-Speed Copper-Filling Performance for Interconnections with Increasing Aspect-Ratio Using Compound Additives
Authors: by Qing Wang, Yang Peng, Yun Mou and Mingxiang Chen
Link: https://www.mdpi.com/2072-666X/13/9/1539

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