Lee, J.; Lee, J.Y.; Song, J.; Sim, G.; Ko, H.; Kong, S.H.
Implementation of Flip-Chip Microbump Bonding between InP and SiC Substrates for Millimeter-Wave Applications. Micromachines 2022, 13, 1072.
https://doi.org/10.3390/mi13071072
AMA Style
Lee J, Lee JY, Song J, Sim G, Ko H, Kong SH.
Implementation of Flip-Chip Microbump Bonding between InP and SiC Substrates for Millimeter-Wave Applications. Micromachines. 2022; 13(7):1072.
https://doi.org/10.3390/mi13071072
Chicago/Turabian Style
Lee, Jongwon, Jae Yong Lee, Jonghyun Song, Gapseop Sim, Hyoungho Ko, and Seong Ho Kong.
2022. "Implementation of Flip-Chip Microbump Bonding between InP and SiC Substrates for Millimeter-Wave Applications" Micromachines 13, no. 7: 1072.
https://doi.org/10.3390/mi13071072
APA Style
Lee, J., Lee, J. Y., Song, J., Sim, G., Ko, H., & Kong, S. H.
(2022). Implementation of Flip-Chip Microbump Bonding between InP and SiC Substrates for Millimeter-Wave Applications. Micromachines, 13(7), 1072.
https://doi.org/10.3390/mi13071072