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Journal: Micromachines, 2022
Volume: 13
Number: 281
Article:
Characteristics of Cracking Failure in Microbump Joints for 3D Chip-on-Chip Interconnections under Drop Impact
Authors:
by
Zhen Liu, Mingang Fang, Lei Shi, Yu Gu, Zhuo Chen and Whenhui Zhu
Link:
https://www.mdpi.com/2072-666X/13/2/281
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