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Journal: MicromachinesVolume: 13Number: 262
Article: Extraction of Interface-Trap Densities of the Stacked Bonding Structure in 3D Integration Using High-Frequency Capacitance-Voltage Technique
  • Authors:
  • Man Li1,2,
  • Yufeng Guo1,2,* and
  • Jiafei Yao1,2,*
  • et al.
Link: https://www.mdpi.com/2072-666X/13/2/262

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