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Journal: MicromachinesVolume: 13Number: 262
Article: Extraction of Interface-Trap Densities of the Stacked Bonding Structure in 3D Integration Using High-Frequency Capacitance-Voltage Technique
- Authors:
- Man Li1,2,
- Yufeng Guo1,2,* and
- Jiafei Yao1,2,*
- et al.
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