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Journal: Micromachines, 2022
Volume: 13
Number: 2159

Article: High-Precision Wafer Bonding Alignment Mark Using Moiré Fringes and Digital Grating
Authors: by Jianhan Fan, Sen Lu, Jianxiao Zou, Kaiming Yang, Yu Zhu and Kaiji Liao
Link: https://www.mdpi.com/2072-666X/13/12/2159

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